Description

Electronic Chip Inspection Module Based on 3D CT Imaging Data

VXEI is an electronic chip inspection module based on 3D CT X-ray imaging data, which can act as VX3D's add-on module or as stand-alone software. Based on the ball shape, location, and volume information, VXEI is able to detect defects, including open solder joints, solder bridges, and abnormal solder balls (big, small, or head-in-pillow shapes).

VXEI can be used for the non-destructive automated inspection of solder joints in various types of packages, such as BGA, PoP, and SoC, in semiconductors and electronic chips.
Once the X-ray image evaluation environment of VXEI is customized to the manufacturer's standards and requirements, VXEI can identify defects automatically through a very simple process.

Features

• Add-on module of VX3D

• Ultra fast speed

• Less than 2 sec to analyze a 12mmx14mm chip

• Applicable to in-line inspection systems

• Detects open solder joints, solder bridges, and abnormal shapes (big, small, or head-in- pillow)

• Automated correction of the chip axis alignment

• Easy to control and adjust parameters

• Customized setup available